Processing method for improving heat radiating structure of LED lighting

• Main Author: SON, JONG BUM
• Format: Patent
• Language: English; Korean
• Published: 08.02.2017
• Subjects: BLASTING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; GRINDING; HEATING; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS; LIGHTING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MECHANICAL ENGINEERING; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; NON-PORTABLE LIGHTING DEVICES; PERFORMING OPERATIONS; POLISHING; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; SYSTEMS THEREOF; TRANSPORTING; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS; WEAPONS

The present invention relates to a processing method for improving a heat dissipation structure of an LED lighting device, in which a bottom surface of a lighting case is flattened through milling processing and a roughing operation is elaborately performed on the bottom surface, and thus an air layer disposed between a PCB substrate and the bottom surface of the lighting case is removed and the PCB substrate and the bottom surface of the lighting case come into thoroughly tight contact with each other, thereby improving efficiency of heat exchange therebetween and improving efficiency of heat dissipation. The processing method for improving a heat dissipation structure of an LED lighting device according to the present invention comprises the steps of: flattening a bottom surface (8) of a lighting case (6) by performing milling processing on the bottom surface (8) configured to come into tight contact with a PCB substrate (4) so as to install the PCB substrate (4), including an LED module (2), in the lighting case (6); and removing an air layer, generated between the PCB substrate (4) and the bottom surface (8) when the PCB substrate (4) and the bottom surface (8) come into contact with each other, through a roughing operation which gradually and finely grinds the bottom surface (8) of the lighting case (6), and in which sandpaper pieces (12) having respective surface roughnesses of 400, 600, 800, 1000, and 1200 are sequentially attached to an electric sender (11) and vibration is applied for 5 to 15 minutes in a state in which each of the sandpaper pieces (12) comes into contact with the bottom surface (8) of the lighting case (6). Accordingly, a heat transfer rate between the PCB substrate (4) and the bottom surface (8) is improved, thereby improving efficiency of heat dissipation. 본발명은 등기구케이스의 바닥면을 밀링가공으로 평평하게 한 후 곱게 라핑작업하여 PCB기판과 등기구케이스의 바닥면 사이에 공기층을 없애 PCB기판과 등기구케이스 바닥면이 완전 밀착되게함으로써 상호간 열전달율을 높여 방열효율이 증대되도록 하는 LED 등기구의 방열구조 개선을 위한 가공방법에 관한 것이다. 본발명은 LED모듈(2)이 구비된 PCB기판(4)을 등기구케이스(6)에 장착되기 위해 PCB기판(4)이 밀착되는 등기구케이스(6)의 바닥면(8)을 밀링가공하여 바닥면(8)을 평평하게 하는 과정, 전동샌드기(11)에 표면거칠기가 400, 600, 800, 1000, 1200인 샌드페이퍼(12)를 순차적으로 부착 후 각 샌드페이퍼(12) 마다 등기구케이스(6)의 바닥면(8)에 접촉상태로 5~15분 동안씩 진동을 가하여 등기구케이스(6)의 바닥면(8)을 점차적으로 곱게하는 라핑작업을 통해 PCB기판(4)과 바닥면(8)의 밀착시 그 사이에 발생되는 공기층을 없애는 과정을 거쳐 상호간 열전달율을 높여 방열효율이 증대되도록 하는 것을 포함하여서 이루어짐을 특징으로 하는 LED 등기구의 방열구조 개선을 위한 가공방법이다.