NICKEL COLLOID CATALYST SOLUTION FOR ELECTROLESS NICKEL OR NICKEL ALLOY PLATING AND ELECTROLESS NICKEL OR NICKEL ALLOY PLATING METHOD

• Main Authors: TANAKA KAORU, KAWABATA AI, UCHIDA EI
• Format: Patent
• Language: English; Korean
• Published: 23.01.2017
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

계면활성제 함유액에 비도전성 기판을 침지하여 예비 흡착 촉진 처리를 실시한 후, (A) 수용성 구리염과 (B) 환원제와 (C) 콜로이드 안정제를 함유한 무전해 니켈도금용 니켈 콜로이드 촉매액으로 비도전성 기판에 촉매를 부여하고, 이어서 무전해 니켈 도금을 실시한다. 흡착 촉진 예비처리에 의해 촉매 활성을 증강시킨 후, 경시안정성이 우수한 촉매액으로 촉매를 부여하고 무전해 도금을 하므로, 석출 얼룩이 없는 균일한 니켈 피막을 얻을 수 있다. 상기 니켈 도금방법으로, 니켈 합금 도금방법에 적용하여도 균일성이 우수한 니켈 합금 피막을 얻을 수 있다. After performing a preliminary adsorption promoting treatment by immersing a non-conductive substrate in a solution containing a surfactant, the non-conductive substrate is provided with a catalyst by means of a nickel colloid catalyst solution for electroless nickel plating, said nickel colloid catalyst solution containing (A) a soluble copper salt, (B) a reducing agent and (C) a colloid stabilizer, and electroless nickel plating is subsequently carried out. Since a catalyst is provided by means of a catalyst solution having excellent long-term stability after enhancing the catalytic activity by a preliminary treatment for promoting adsorption and the electroless plating is subsequently carried out, it becomes possible to obtain a uniform nickel coating film that is free from deposition unevenness. In cases where the present invention is applied to a nickel alloy plating method instead of the above-described nickel plating method, a nickel alloy coating film having excellent uniformity is able to be obtained.