3D 3-DIMENSION PRINTING APPARATUS AND METHOD FOR FABRICATING CASE OF ELECTRONICS USING THE SAME

• Main Author: LEE, YOUNG CHURL
• Format: Patent
• Language: English; Korean
• Published: 11.01.2017
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The present invention relates to a method for forming a casing of electronics using a 3D printing apparatus. The method for forming a casing of electronics according to the present invention comprises the steps of: spraying casing materials, resistance materials, conductive materials, magnetic materials and dielectric materials under a predetermined pressure to form a casing main body in which a printed circuit, a first resistance, a first inductor and a first capacitor are embedded; spraying casing materials and conductive materials to both sides of the casing main body to provide a central circuit space, thereby forming side walls of the casing main body comprising a printed circuit therein; spraying conductive materials, magnetic materials and dielectric materials into the central circuit space under a predetermined pressure to form a circuit element including at least one second resistance, a second inductor, a second capacitor and a third capacitor, and a printed circuit connecting one circuit element with another circuit element on the top of the casing main body. 본 발명은 3D 프린팅 장치를 이용한 전자제품용 케이스 형성 방법으로서, 케이스용 재료, 저항 재료, 전도성 재료, 자성체 재료 및 유전체 재료를 소정 압력을 통해 분사하여 회로 배선, 제 1 저항, 제 1 인덕터 및 제 1 커패시터가 매립된 케이스 본체를 형성하는 단계와, 중앙의 회로 공간을 구비하도록 케이스 본체의 양측에 케이스용 재료와 전도성 재료를 분사하여 내부에 회로 배선이 포함된 케이스 본체의 측벽을 형성하는 단계와, 중앙의 회로 공간 내에 전도성 재료, 자성체 재료 및 유전체 재료를 소정 압력을 통해 분사하여 케이스 본체 상부에 적어도 하나 이상의 제 2 저항, 제 2 인덕터, 제 2 커패시터 및 제 3 커패시터를 포함하는 회로 소자와 회로 소자 각각을 연결시키는 회로 배선을 형성하는 단계를 포함하는 것을 특징으로 하는 3D 프린팅 장치를 이용한 전자제품용 케이스 형성 방법을 제공한다.