METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD

• Main Authors: BRUGAROLAS BRUFAU TERESA, KOZHUKH JULIA, TONG YUHUA, JACOB GEORGE C, DEGROOT MARTY W, LUGO DIEGO, VENEZIALE DAVID MICHAEL, WANK ANDREW, YEH FENGJI, MILLER JEFFREY B, QIAN BAINIAN
• Format: Patent
• Language: English; Korean
• Published: 04.01.2017
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

According to the present invention, provided is a method to make a polishing layer for a chemical mechanical polishing (CMP) pad, comprising the following steps of: providing a mold having a basis with intaglio of a groove pattern; providing a polycide (P) liquid component; providing an isocide (I)...