ELECTRODEPOSITED COPPER FOIL

Provided is an electroplated copper foil having 50-80% of a texture coefficient for plane (200) based on the total texture coefficients of plane (111), plane (200), plane (220), and plane (200) of the electroplated copper foil. The electroplated copper foil is particularly proper for application to...

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Bibliographic Details
Main Authors CHENG KUEI SEN, CHOU JUI CHANG, LIU YUEH MIN, LO HSI HSING, LAI YAO SHENG
Format Patent
LanguageEnglish
Korean
Published 02.01.2017
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:Provided is an electroplated copper foil having 50-80% of a texture coefficient for plane (200) based on the total texture coefficients of plane (111), plane (200), plane (220), and plane (200) of the electroplated copper foil. The electroplated copper foil is particularly proper for application to a printed circuit board and a lithium ion secondary battery. 전착된 구리 포일의 면(111), 면(200), 면(220) 및 면(200)의 텍스처 계수의 총합 기준, 50% 내지 80% 의 면(200)의 텍스처 계수를 갖는, 전착된 구리 포일이 제공된다. 전착된 구리 포일은 인쇄회로기판 및 리튬 이온 2차 전지의 적용에 이용하기에 특히 적절하다.
Bibliography:Application Number: KR20160175450