METHOD FOR PRODUCING PATTERNED MATERIALS

• Main Authors: SCHORZMAN DEREK, ERMOSHKIN ALEXANDER, SPRAGUE JACOB
• Format: Patent
• Language: English; Korean
• Published: 30.12.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FREQUENCY-CHANGING; HOLOGRAPHY; MATERIALS THEREFOR; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

대면적 패턴 필름은 제1 패턴 영역; 제2 패턴 영역; 및 제1 패턴 영역과 제2 영역을 접합하는 이음매를 포함하되, 이음매는 약 20 마이크로미터 미만의 폭을 갖는다. 패턴 영역을 타일링하는 방법은 미리 정해진 두께의 경화성 재료를 놓는 단계; 경화성 재료의 제1 부분을 몰드와 접촉시키는 단계; 경화성 재료의 제1 부분을 경화시키는 단계; 경화성 재료의 경화된 제1 부분으로부터 몰드를 제거하는 단계; 몰드가 경화성 재료의 경화된 제1 부분의 일부와도 접촉하도록 경화성 재료의 제2 부분을 몰드와 접촉시키는 단계; 경화성 재료의 제2 부분을 경화시키는 단계; 및 몰드를 제거하여 경화성 재료의 경화된 제1 부분과 경화성 재료의 경화된 제2 부분 사이에 약 20 마이크로미터 미만의 크기를 갖는 이음매를 생성하는 단계를 포함한다. A large area patterned film includes a first patterned area; a second patterned area; and a seam joining the first patterned area and the second patterned area, wherein the seam has a width less than about 20 micrometers. A method for tiling patterned areas includes depositing a predetermined thickness of a curable material; contacting a first portion of the curable material with a mold; curing the first portion of the curable material; removing the mold from the cured first portion of the curable material; contacting a second portion of the curable material with the mold, such that the mold contacts a portion of the cured first portion of the curable material; curing the second portion of the curable material; and removing the mold to yield a seam between the cured first portion of the curable material and the cured second portion of the curable material, wherein the seam has a dimension less than about 20 micrometers.