Thin film deposition apparatus

• Main Authors: YOON, DAE GEUN, CHO, HYOUNG JIN
• Format: Patent
• Language: English; Korean
• Published: 21.12.2016
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention relates to a thin film deposition apparatus. According to the present invention, a thin film deposition apparatus comprises: a chamber having a deposition space therein; a gas supply unit provided in the chamber, and supplying process gas; a substrate support unit provided in the deposition space for a substrate to be mounted, and provided to reciprocate in a predetermined distance in a lower portion of the gas supply unit; and a powder removing unit preventing powder from being accumulated in a lower portion of the chamber by process gas supplied from the gas supply unit. 본 발명은 박막증착장치 에 관한 것이다. 본 발명에 따른 박막증착장치는 내부에 증착공간이 마련된 챔버, 상기 챔버 내부에 구비되어 프로세스가스를 공급하는 가스공급부, 상기 증착공간에 구비되어 기판이 안착되며 상기 가스공급부의 하부에서 소정거리 왕복이동 가능하게 구비되는 기판지지부 및 상기 가스공급부에서 공급된 공정가스에 의해 상기 챔버의 하부에 파우더가 쌓이는 것을 방지하는 파우더 제거부를 구비하는 것을 특징으로 한다.