LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME
The present invention provides a light emitting diode package having a wide angle of beam spread. According to the present invention, the light emitting diode package includes an encapsulation layer encapsulating a light emitting diode chip connected to first and second lead electrodes. At least one...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
08.12.2016
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides a light emitting diode package having a wide angle of beam spread. According to the present invention, the light emitting diode package includes an encapsulation layer encapsulating a light emitting diode chip connected to first and second lead electrodes. At least one of a long side and a short side of the encapsulation layer can be exposed to the outside.
본 발명은 넓은 광 지향각을 갖는 발광 다이오드 패키지를 제공하는 것으로, 본 발명에 따른 발광 다이오드 패키지는 제 1 및 제 2 리드 전극에 연결된 발광 다이오드 칩을 봉지하는 봉지층을 포함하며, 봉지층의 장변 및 단변 중 적어도 한 변은 외부로 노출될 수 있다. |
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Bibliography: | Application Number: KR20150075793 |