Method for producing metal laminate material

• Main Authors: KUROKAWA TEPPEI, KOSHIRO TAKASHI, OKAYAMA HIRONAO, NANBU KOUJI
• Format: Patent
• Language: English; Korean
• Published: 06.12.2016
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

충분한 접합력을 유지하면서 보다 생산 효율이 우수한 금속 적층재의 제조 방법을 제공하는 것을 목적으로 한다. 각각 M1 및 M2의 재질로 이루어지는 2개의 판을 접합함으로써 금속 적층재를 제조하는 방법으로서, M1 및 M2가 각각 Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Pd, Ag, In, Sn, Hf, Ta, W, Pb 및 Bi로 이루어지는 군에서 선택되는 어느 1종 이상을 포함하는 금속 또는 합금이며, 2개의 판이 접합하는 면에 대해 표층의 산화막이 잔존하도록 진공 중에서의 비활성 가스 이온에 의한 스퍼터 처리를 실시하는 공정과, 롤 압접에 의해 2개의 판을 가접합하는 공정과, 열처리를 행하여 2개의 판을 접합하는 공정을 포함하고, M1의 융점이 Tm1(K)이고 M2의 융점이 Tm2(K)이며 Tm1>Tm2로 하였을 때, 열처리의 온도가 0.45Tm2 이상 0.45Tm1 미만(단, Tm2는 넘지 않음)인 것을 특징으로 한다. An object of the present invention is to provide a method for producing a metal laminate material that maintains sufficient bonding strength and has superior production efficiency. A method for producing a metal laminate material by bonding two sheets, one sheet composed of a material M1 and the other sheet composed of a material M2, wherein each of M1 and M2 is a metal or alloy comprising any one or more selected from the group consisting of Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Pd, Ag, In, Sn, Hf, Ta, W, Pb, and Bi, comprises the steps of: subjecting the faces of the two sheets to be bonded to sputtering treatment with inert gas ions under vacuum such that oxide layers on surface layers remain; temporarily bonding the two sheets by roll pressure bonding; and conducting a thermal treatment to thereby bond the two sheets, and, when Tm1 > Tm2 where Tm1(K) is the melting point of M1 and Tm2(K) is the melting point of M2, the temperature of the thermal treatment is 0.45Tm2 or more and less than 0.45Tm1, provided that the temperature is not more than Tm2.