Printed circuit board semiconductor package and method of manufacturing the same

According to the present invention, a semiconductor package includes: an insulation layer; a printed circuit board having a circuit layer including a metal pad exposed to both side surfaces and the lower surface of the insulation layer; and a semiconductor device mounted in the upper portion of the...

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Bibliographic Details
Main Authors PARK, HEUNG WOO, CHOI, JUNG GON, KIM, JONG MAN, LIM, JAE HYUN, KIM, JIN SU, KIM, SUN HO
Format Patent
LanguageEnglish
Korean
Published 06.12.2016
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:According to the present invention, a semiconductor package includes: an insulation layer; a printed circuit board having a circuit layer including a metal pad exposed to both side surfaces and the lower surface of the insulation layer; and a semiconductor device mounted in the upper portion of the printed circuit board. 본 발명에 따른 반도체 패키지는 절연층; 상기 절연층의 양 측면과 하부면에 노출된 금속 패드를 포함하는 회로층을 갖는 인쇄회로기판; 및 상기 인쇄회로기판의 상부에 실장된 반도체 소자를 포함하여 구성된다.
Bibliography:Application Number: KR20150073013