RESIN COMPOSITION

• Main Authors: EDO YUKINORI, KAWAI KENJI
• Format: Patent
• Language: English; Korean
• Published: 09.11.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES; WORKING-UP

Provided are: a resin composition which forms an insulating layer having excellent adhesion to a conductor layer even if having low illumination and having a high glass transition point: and an adhesive film, a prepreg, a printed wiring board, and a semiconductor device using the same. The resin composition comprises: (A) an epoxy resin; (B) a maleimide-containing silyl-protected phenol; and (C) an active ester compound. [과제] 저조도라도 도체층에 대한 밀착성이 우수하고, 유리 전이점이 높은 절연층을 형성하는 수지 조성물, 그것을 사용한 접착 필름, 프리프레그, 프린트 배선판, 및 반도체 장치의 제공. [해결 수단] (A) 에폭시 수지, (B) 말레이미드 함유 실릴 보호 페놀, 및 (C) 활성 에스테르 화합물을 함유하는, 수지 조성물. [선택도] 없음