MOISTURE-CURABLE HOT MELT ADHESIVE FOR LIGHTING APPLIANCES

• Main Authors: DOBASHI MASAAKI, TAKAHASHI TOMONORI, MORISHITA TAKAHIDE, TSUNO SHINGO
• Format: Patent
• Language: English; Korean
• Published: 02.11.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

본 발명의 목적은 이소시아네이트 화합물 및 습기의 반응에 의한 이산화탄소 버블의 생성 뿐 아니라, 미경화된 접착제가 가열될 때의 부피 팽창을 상당히 억제할 수 있는 습기-경화형 핫 멜트 접착제를 제공하는 것이다. 본 발명은 하기 성분을 포함하는 조명 기구 용의 습기-경화형 핫 멜트 접착제에 관한 것이다: 폴리올 화합물과 이소시아네이트 화합물을 혼합함으로써 수득된 우레탄 프리폴리머, 열가소성 폴리아크릴 수지 및 옥사졸리딘 화합물. An object of the present invention is to provide a moisture-curable hot melt adhesive which can substantially suppress generation of carbon dioxide bubbles by a reaction of an isocyanate compound and moisture as well as volume expansion when an uncured adhesive is heated. The present invention relates to a moisture-curable hot melt adhesive for lighting appliances comprising: an urethane prepolymer obtained by mixing a polyol compound and an isocyanate compound, a thermoplastic polyacrylic resin and an oxazolidine compound.