PRINTED CIRCUIT BOARD
The present invention relates to a printed circuit board, which comprises: an insulating layer; a via hole passing through the insulating layer, and having the same width on one surface and the other surface of the insulating layer; and a thermal via made of a metal material for filling the via hole...
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| Main Authors | , |
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| Format | Patent |
| Language | English Korean |
| Published |
26.10.2016
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present invention relates to a printed circuit board, which comprises: an insulating layer; a via hole passing through the insulating layer, and having the same width on one surface and the other surface of the insulating layer; and a thermal via made of a metal material for filling the via hole. The printed circuit board has a coreless structure which can highly radiate heat through the thermal via having a structure with upper and lower units with the same width.
본 발명은 인쇄회로기판에 관한 것으로, 절연층; 상기 절연층을 관통하며, 상기 절연층의 일면과 타면 상의 폭이 동일한 비아 홀(via hole); 및 상기 비아 홀을 채우는 금속 재료의 열 비아(thermal via);를 포함한다. |
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| AbstractList | The present invention relates to a printed circuit board, which comprises: an insulating layer; a via hole passing through the insulating layer, and having the same width on one surface and the other surface of the insulating layer; and a thermal via made of a metal material for filling the via hole. The printed circuit board has a coreless structure which can highly radiate heat through the thermal via having a structure with upper and lower units with the same width.
본 발명은 인쇄회로기판에 관한 것으로, 절연층; 상기 절연층을 관통하며, 상기 절연층의 일면과 타면 상의 폭이 동일한 비아 홀(via hole); 및 상기 비아 홀을 채우는 금속 재료의 열 비아(thermal via);를 포함한다. |
| Author | PARK, CHUNG SIK SHIN, SEUNG YUL |
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| Notes | Application Number: KR20150053662 |
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| RelatedCompanies | LG INNOTEK CO., LTD |
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| Snippet | The present invention relates to a printed circuit board, which comprises: an insulating layer; a via hole passing through the insulating layer, and having the... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | PRINTED CIRCUIT BOARD |
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