PRINTED CIRCUIT BOARD

The present invention relates to a printed circuit board, which comprises: an insulating layer; a via hole passing through the insulating layer, and having the same width on one surface and the other surface of the insulating layer; and a thermal via made of a metal material for filling the via hole...

Full description

Saved in:
Bibliographic Details
Main Authors PARK, CHUNG SIK, SHIN, SEUNG YUL
Format Patent
LanguageEnglish
Korean
Published 26.10.2016
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:The present invention relates to a printed circuit board, which comprises: an insulating layer; a via hole passing through the insulating layer, and having the same width on one surface and the other surface of the insulating layer; and a thermal via made of a metal material for filling the via hole. The printed circuit board has a coreless structure which can highly radiate heat through the thermal via having a structure with upper and lower units with the same width. 본 발명은 인쇄회로기판에 관한 것으로, 절연층; 상기 절연층을 관통하며, 상기 절연층의 일면과 타면 상의 폭이 동일한 비아 홀(via hole); 및 상기 비아 홀을 채우는 금속 재료의 열 비아(thermal via);를 포함한다.
Bibliography:Application Number: KR20150053662