EMBEDDED PRINTED CIRCUIT SUBSTRATE

The present invention relates to an embedded printed circuit board, which prevents a mold flash, and reduces manufacturing costs. The embedded printed circuit board comprises: an insulating board including a cavity; a sensor device arranged in the cavity; and an adhesive layer formed in an area exce...

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Bibliographic Details
Main Authors PARK, CHUNG SIK, LEE, SANG MYUNG, JUNG, WON SUK, AN, YUN HO
Format Patent
LanguageEnglish
Korean
Published 24.10.2016
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention relates to an embedded printed circuit board, which prevents a mold flash, and reduces manufacturing costs. The embedded printed circuit board comprises: an insulating board including a cavity; a sensor device arranged in the cavity; and an adhesive layer formed in an area except the cavity on the insulating board, and formed on the sensor device. 본 발명은 임베디드 인쇄회로기판에 관한 것으로, 캐비티를 포함하는 절연 기판; 상기 캐비티에 배치되는 센서 소자; 및 상기 절연 기판 상에서 상기 캐비티 이외의 영역과 상기 센서 소자 상에 형성되는 접착층;을 포함한다.
Bibliography:Application Number: KR20150052279