POLYIMIDE RESIN HAVING VINYL GROUP AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING SAME

• Main Authors: LEE, JAE WOO, OH, SEUNG KEUN, RYU, HYUN KYU, KIM, JAE HYUN, HAN, DONG WOO
• Format: Patent
• Language: English; Korean
• Published: 19.10.2016
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention relates to a polyimide resin having a vinyl group, and to a photosensitive resin composition comprising the same. More particularly, the photosensitive resin composition has a lower free volume by mutually cross-linking polyimides by using a polyimide resin having a vinyl group, thereby preventing diffusion of copper ions. Also, the photosensitive composition can be cured at a low temperature. 본 발명은 비닐기를 갖는 폴리이미드 수지 및 이를 포함하는 비닐기를 갖는 폴리이미드를 포함하는 감광성 수지 조성물에 관한 것으로, 더욱 상세하게는 비닐기를 갖는 폴리이미드 수지를 사용함으로써 상기 폴리이미드끼리 서로 가교결합되어 수지의 프리 볼륨을 낮추고, 이로 인해 구리 이온 확산을 방지할 수 있을 뿐 아니라, 저온 경화가 가능한, 비닐기를 갖는 폴리이미드를 포함하는 감광성 수지 조성물에 관한 것이다.