Printed circuit board and method of manufacturing the same and electronic component module

Disclosed are a printed circuit board which is easy to control bending, a manufacturing method thereof, and an electronic component module. The printed circuit board comprises: a circuit board having a through part and a first circuit pattern; and a connection board having a fine circuit structure i...

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Bibliographic Details
Main Authors KWEON YOUNG DO, KOOK, SEUNG YEOP, LEE, JEONG HO, KIM, HYOUNG JOON
Format Patent
LanguageEnglish
Korean
Published 17.10.2016
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Disclosed are a printed circuit board which is easy to control bending, a manufacturing method thereof, and an electronic component module. The printed circuit board comprises: a circuit board having a through part and a first circuit pattern; and a connection board having a fine circuit structure including a second circuit pattern, and received in the through part. 인쇄회로기판, 그 제조방법 및 전자부품 모듈이 개시된다.
Bibliography:Application Number: KR20150048937