HYBRID CHIP-ON-BOARD LED MODULE WITH PATTERNED ENCAPSULATION

• Main Authors: SOER WOUTER ANTHON, HELBING RENE, HUANG GUAN
• Format: Patent
• Language: English; Korean
• Published: 27.09.2016
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; WEAPONS

상이한 파장 변환 물질들, 또는 파장 변환 물질의 상이한 농도들이 하이브리드 발광 모듈의 상이한 컬러들의 발광 엘리먼트들을 캡슐화하기 위해 사용된다. 이 발명의 실시예에서, 특정 컬러의 제2 발광 엘리먼트들(170)은 투명한 제2 캡슐화제(120; 420; 520)로 캡슐화되고, 상이한 컬러의 제1 발광 엘리먼트들(160)은 파장 변환 제1 캡슐화제(110; 410; 510)로 캡슐화된다. 이 발명의 또다른 실시예에서, 상이한 컬러들의 제2 및 제3 발광 엘리먼트들(170, 580)의 특정한 제2 세트가 제1 발광 엘리먼트들(160)의 또다른 제1 세트와는 상이한 캡슐화제로 캡슐화된다. Light modules and methods of forming light modules are disclosed. A light module includes a first plurality and a second plurality of light emitting elements configured to emit, respectively, a first light and a second light, and both arranged on a substrate. An encapsulation layer is disposed over the first and second plurality of the light emitting elements, and a wavelength converting element is dispersed in the encapsulation layer. A concentration of the wavelength converting element in the encapsulation layer varies, is larger over the first plurality of light emitting elements and is smaller over the second plurality of light emitting elements.