FILM FORMING METHOD AND HEAT TREATMENT APPARATUS

• Main Authors: SAKAKIBARA YASUAKI, KIKUCHI YOSHIYUKI, SAMUKAWA SEIJI
• Format: Patent
• Language: English; Korean
• Published: 12.09.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

처리 용기 내의 처리실에 있는 기판 상에 저유전율막을 형성하는 성막 방법 이며, 처리 용기 내에서 처리실의 상방에 형성된 플라즈마 생성실에 적어도 희가스를 공급해서 마이크로파를 이용하여 플라즈마를 생성하고, 플라즈마 생성실과 처리실 사이에 설치되고, 이 플라즈마 생성실과 이 처리실을 연통(連通)시키는 복수의 개구를 가지며 또한 자외선에 대한 차폐성을 갖는 차폐부를 통해, 플라즈마 생성실로부터 처리실에 입자를 공급하고, 이 처리실에 전구체 가스를 공급하여, 기판 상에 저유전율막을 형성하며, 그 후 그 기판에 대해 가열 처리를 행한다. Provided is a method for forming a low dielectric constant film on a substrate placed in a processing chamber inside a processing container. The method includes: generating plasma using microwaves by supplying at least a noble gas to a plasma generation chamber, which is formed above the processing chamber inside the processing container; forming a low dielectric constant film on the substrate by supplying particles from the plasma generation chamber to the processing chamber and supplying a precursor gas to the processing chamber through a shield unit provided between the plasma generation chamber and the processing chamber, the shield unit having a plurality of openings configured to communicate the plasma generation chamber with the processing chamber, and having a shielding property against ultraviolet light; and then, performing a heat treatment on the substrate.