RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING THE SAME

• Main Authors: SHIM, JI HYE, KIM, KI SEOK, WOO, JI EUN, JUNG, HYUNG MI
• Format: Patent
• Language: English; Korean
• Published: 31.08.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention relates to a resin composition, and to a printed circuit board comprising the same. According to an embodiment of the present invention, the resin composition includes an epoxy resin, and a teflon resin. The teflon resin has nanosilica arranged on the surface, wherein the nanosilica may have a diameter of 5.0 m or less. The teflon resin constitutes 20-50 wt% based on the total weight of the resin composition, and may further comprise a silica filler as a filler. The resin composition has high miscibility and dispersibility. 본 발명은 수지 조성물 및 이를 포함하는 인쇄회로기판에 관한 것으로, 본 발명의 실시 예를 따르는 수지 조성물은, 에폭시 수지 및 테플론 수지를 포함하고, 상기 테플론 수지는 표면에 배치된 나노 실리카를 포함하고, 상기 나노 실리카의 입경은 5.0 μｍ 이하일 수 있고, 상기 테플론 수지의 함량은 수지 조성물 전체 중량을 기준으로 할 때, 20 wt% 내지 50 wt%이고, 필러로서 실리카 필러를 더 포함할 수 있다.