METHOD FOR MANUFACTURING BURIED CONDUCTIVE PATTERN

The present invention provides a method for manufacturing a buried conductive pattern. The method for manufacturing a buried conductive pattern includes the following steps: a) forming an engraved groove in a base material; b) forming a plating seed layer by filling the engraved groove with a conduc...

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Bibliographic Details
Main Authors HAN, DAE SANG, CHUNG, KWANG CHOON, YOO, JI HOON
Format Patent
LanguageEnglish
Korean
Published 25.08.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a method for manufacturing a buried conductive pattern. The method for manufacturing a buried conductive pattern includes the following steps: a) forming an engraved groove in a base material; b) forming a plating seed layer by filling the engraved groove with a conductive ink; and c) forming a metal layer inside the engraved groove by plating the plating seed layer located inside the engraved groove. Therefore, the present invention can reduce the thickness of the base material and prevent a metal migration. 본 발명은, a)기재에 음각 홈을 형성하는 단계; b) 상기 음각 홈에 전도성 잉크를 충전하여 도금 시드층을 형성하는 단계; 및 c) 상기 음각 홈 내부에 위치한 상기 도금 시드층에 도금하여, 상기 음각홈 내부에 금속층을 형성하는 단계를 포함하는 것을 특징으로 하는 전도성 매립패턴의 형성방법을 제공한다.
Bibliography:Application Number: KR20150023142