STRIPPING SOLUTION AND STRIPPING METHOD
The present invention relates to stripping liquor and a stripping method. The stripping liquor and the stripping method are to strip a substrate adhering to a support plate by an adhesive agent from the support plate without causing damages to the substrate or generating residues. The stripping liqu...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
18.08.2016
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to stripping liquor and a stripping method. The stripping liquor and the stripping method are to strip a substrate adhering to a support plate by an adhesive agent from the support plate without causing damages to the substrate or generating residues. The stripping liquor of the present invention which is a means to strip the substrate adhering to the support plate by the adhesive agent from the support plate penetrates structurally the adhesive agent, promotes solubility and dissolution rate of the same, and solves the problem of the adhesive agent residues generated after stripping the substrate. Moreover, the stripping liquor does not cause damages like cracks on a surface of the substrate which has a circuit pattern of elements formed thereon as peel stress is not applied to the substrate to be adhered. Thus, it is expected that the stripping liquor has effects of: enhancing semi-conductor processing efficiency; and promoting quality enhancement.
본 발명은 박리액 및 박리방법에 관한 것으로, 접착제에 의해 지지판에 접착된 기판을 손상이나 잔류물 없이 당해 지지판으로부터 박리시키기 위한 박리액 및 박리방법에 관한 것이다. 본 발명의 박리액은, 접착제에 의해 지지판에 접착된 기판을 당해 지지판으부터 박리시키기 위한 수단으로서, 접착제에 구조적으로 침투하여, 접착제의 용해력 및 용해 속도를 향상시키고, 박리 후 접착제 잔류물이 남는 문제를 해결할 수 있다. 또한, 피착체인 기판에 박리 응력에 의한 스트레스를 부여하지 않으므로, 소자의 회로 패턴이 형성된 기판 표면 상에 크랙 등의 손상을 주지 않을 수 있어, 반도체 가공 효율을 개선시키며, 품질 향상에도 기여할 것으로 기대된다. |
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Bibliography: | Application Number: KR20160100450 |