EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE

• Main Authors: KOHARA KAZUYUKI, OKOSHI KODAI, ABE NOBUYUKI, YAMAZAWA TOMOYA
• Format: Patent
• Language: English; Korean
• Published: 03.08.2016
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

에폭시 수지 조성물은 (A) 에폭시 수지와, (B) 경화제와, (C) 0.1∼10질량％의 평균 입경 10㎚ 이상 100㎚ 이하인 실리카 필러와, (D) 47∼75질량％의 평균 입경 0.3㎛ 이상 2㎛ 이하인 실리카 필러와, (E) 0.1∼8질량％의 엘라스토머를 갖고, 상기 (C) 성분 및 상기 (D) 성분을 합계로 50.1∼77질량％ 포함한다. An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 2 μm or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.