AQUEOUS PRIMER COMPOSITION FOR ENHANCED FILM FORMATION AND METHOD OF USING THE SAME

• Main Authors: ZHAO YIQIANG, KOHLI DALIP KUMAR, SHAH GAURANG KUNAL
• Format: Patent
• Language: English; Korean
• Published: 12.07.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

수계 접착 프라이머 조성물 및 접착제 접착 전 상기 수계 접착 프라이머 조성물을 금속 표면 상에 도포하는 방법. 상기 접착 프라이머 조성물은 물, 하나 이상의 에폭시 수지, 하나 이상의 경화제, 실란 화합물, 적은 양의 프로필렌 카보네이트(PC), 및 임의의 첨가제를 함유하는 수계 분산물이다. 상기 접착 프라이머 조성물은 분무에 의해 실질적으로 매끄러운 필름을 형성할 수 있고, 동시에, 환경 규제를 만족할 수 있으며, 높은 접착 성능을 제공할 수 있다. A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.