THICKNESS MEASUREMENT OF A HEMISPHEREVESSEL IN APPARATUS CHAMBER USING MAGNETOSTRICTIVE ULTRASONIC AND MEASURING METHOD OF THE SAME

The present invention relates to a hemisphere thickness measurement apparatus, and a hemisphere thickness measurement method. The hemisphere thickness measurement apparatus measures the thickness of a hemisphere inside a chamber in real-time when a base material of the hemisphere exposed to a high-t...

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Bibliographic Details
Main Authors KOO, KIL MO, KIM, HWAN YEOL, SONG, JIN HO
Format Patent
LanguageEnglish
Korean
Published 07.07.2016
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Summary:The present invention relates to a hemisphere thickness measurement apparatus, and a hemisphere thickness measurement method. The hemisphere thickness measurement apparatus measures the thickness of a hemisphere inside a chamber in real-time when a base material of the hemisphere exposed to a high-temperature condition is gradually eroded. More specifically, the hemisphere thickness measurement apparatus inside a chamber using a magnetostrictive ultrasonic wave can precisely measure a thickness change of the hemisphere in real-time by securing reliability of an ultrasonic wave in the high-temperature condition by using the magnetostrictive ultrasonic wave. 본 발명은 고온에 노출된 반구의 모재가 점진적으로 침식 시 실시간으로 챔버 내에 실험 반구의 두께를 측정하기 위한 반구 두께측정 장치 및 방법에 관한 것으로, 더욱 상세하게는, 자왜 초음파를 이용하여 고온 환경에서도 초음파의 신뢰성을 확보함에 따라 반구의 두께 변화를 실시간으로 정밀하게 측정할 수 있는 자왜 초음파를 이용한 챔버 내에 반구 두께측정 장치 및 방법에 관한 것이다.
Bibliography:Application Number: KR20140191904