PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

According to an embodiment of the present invention, a printed circuit board (PCB) is provided. The PCB comprises: an insulation layer; and a pattern layer placed on at least one surface of the insulation layer, wherein the pattern layer includes a circuit pattern and a residual pattern electrically...

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Bibliographic Details
Main Author PARK, SUNG YEOL
Format Patent
LanguageEnglish
Korean
Published 01.07.2016
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:According to an embodiment of the present invention, a printed circuit board (PCB) is provided. The PCB comprises: an insulation layer; and a pattern layer placed on at least one surface of the insulation layer, wherein the pattern layer includes a circuit pattern and a residual pattern electrically disconnected to the circuit pattern. The present invention provides a PCB, with a simplified manufacturing process, an improved circuit pattern, and alleviated via malfunction. 본 발명의 일 실시형태는 절연층; 및 상기 절연층의 적어도 일면에 배치된 패턴층; 을 포함하며, 상기 패턴층은 회로패턴 및 상기 회로패턴과 전기적으로 단절된 잔류패턴을 포함하는 인쇄회로기판을 제공한다.
Bibliography:Application Number: KR20140187400