LED PACKAGE HAVING A MICRO LIGHT SOURCE AND ITS MANUFACTURING METHOD
According to the present invention, disclosed are a light emitting diode (LED) package having a small light source and a manufacturing method thereof, capable of enhancing light efficiency by reducing the total reflection of light emitted from a light emitting device. According to the present invent...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
14.06.2016
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Subjects | |
Online Access | Get full text |
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Summary: | According to the present invention, disclosed are a light emitting diode (LED) package having a small light source and a manufacturing method thereof, capable of enhancing light efficiency by reducing the total reflection of light emitted from a light emitting device. According to the present invention, the LED package comprises: the light emitting device formed in a lead frame; a partition unit formed in the lead frame apart from the light emitting device to surround the light emitting device while transmitting the light emitted from the light emitting device; a transparent lens accommodating the light emitting device and the partition unit in the inside to reduce the total reflection of the light emitted from the light emitting device; and a reflector installed in the lead frame to reflect the light emitted from the light emitting device. A filling material including a fluorescent substance is prepared in a partitioned space part formed by the partition unit and the transparent lens is installed in the reflector.
소형광원이 구비된 엘이디 패키지 및 제조방법이 개시된다. 본 발명의 엘이디 패키지는, 리드 프레임에 마련되는 발광 소자; 리드 프레임에 발광 소자와 이격 마련되어 발광 소자에서 방출되는 빛을 투과시키되 발광 소자를 둘러싸도록 마련되는 격벽부; 발광 소자와 격벽부가 내부에 수용되도록 마련되어 발광 소자로부터 방출되는 빛이 전반사 되는 것을 감소시키는 투명렌즈; 및 리드 프레임에 마련되어 발광 소자에서 방출되는 빛을 반사시키는 리플렉터를 포함하고, 격벽부에 의해 마련된 격벽 공간부에 형광체가 포함된 충진재가 마련되고, 투명렌즈는 리플렉터에 마련되는 것을 특징으로 한다. |
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Bibliography: | Application Number: KR20140173056 |