CLEANER COMPOSITION
The present invention relates to a cleaning composition for a microelectronic substrate. The cleaning composition comprises: hydrogen peroxide; a metal oxidation-reduction inhibitor; an inorganic compound including ammonium ions; an oxidation co-stabilizer; a metal anticorrosive; and water. The clea...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
14.06.2016
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a cleaning composition for a microelectronic substrate. The cleaning composition comprises: hydrogen peroxide; a metal oxidation-reduction inhibitor; an inorganic compound including ammonium ions; an oxidation co-stabilizer; a metal anticorrosive; and water. The cleaning composition is stabilized by minimizing the amount of organic matter. According to the present invention, the cleaning composition can maintain residue removal rate with respect to changes according to time by preventing changes in the hydrogen peroxide content and suppressing changes in pH of the cleaning solution.
본 발명은 마이크로전자 기판용 세정제 조성물에 관한 것으로서, 과산화수소, 금속 산화환원 억제제, 암모늄이온을 포함하는 무기 화합물, 산화 보조 안정화제, 금속 부식방지제 및 물을 포함하며, 유기물을 최소화함으로써 안정화된 세정제 조성물을 제공한다. 본 발명에 따른 세정제 조성물에 의하면, 과산화수소의 함량 변화를 방지함으로써 세정제 조성물의 pH 변화를 억제할 수 있으므로, 경시변화에 따른 잔류물 제거속도를 유지할 수 있다. |
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Bibliography: | Application Number: KR20140173040 |