SEMICONDUCTOR PACKAGE

A semiconductor package is provided. The semiconductor package comprises: a base film having an upper surface and a rear surface; a circuit pattern arranged on the upper surface of the base film and connected to a ground line; a penetration hole configured to penetrate the base film; and a lower shi...

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Bibliographic Details
Main Authors CHOI, KYOUNG SEI, PARK, JI YONG, KIM, WOON BAE
Format Patent
LanguageEnglish
Korean
Published 07.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package is provided. The semiconductor package comprises: a base film having an upper surface and a rear surface; a circuit pattern arranged on the upper surface of the base film and connected to a ground line; a penetration hole configured to penetrate the base film; and a lower shielding film electrically connected to the circuit pattern, and configured to completely bury the penetration hole to extend toward the rear surface of the base film. Therefore, the semiconductor package can prevent electro-magnetic interference by the lower shielding film. 반도체 패키지를 제공한다. 반도체 패키지는, 상면 및 후면을 갖는 베이스 필름, 베이스 필름의 상면 상에 배치되며 접지 배선에 연결된 회로 패턴, 베이스 필름을 관통하는 관통 홀, 및 회로 패턴과 전기적으로 연결되며, 상기 관통 홀을 완전히 매립하며 베이스 필름의 후면으로 연장하는 하부 차폐막을 포함한다.
Bibliography:Application Number: KR20140166542