INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

• Main Authors: CHEBIAM RAMANAN V, YOO HUI JAE, INDUKURI TEJASWI K, CLARKE JAMES S
• Format: Patent
• Language: English; Korean
• Published: 01.06.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

유전체 층 및 이를 형성하는 방법이 개시된다. 유전체 층 내에 개구가 정의되고 개구 내에 와이어가 퇴적되고, 와이어는 재킷 물질에 의해 둘러싸인 코어 물질을 포함하고, 재킷 물질은 제1 비저항(ρ1)을 나타내고, 코어 물질은 제2 비저항(ρ2)을 나타내고, ρ2는 ρ1보다 더 작다. A dielectric layer and a method of forming thereof. An opening defined in a dielectric layer and a wire deposited within the opening, wherein the wire includes a core material surrounded by a jacket material, wherein the jacket material exhibits a first resistivity ρ1 and the core material exhibits a second resistivity ρ2 and ρ2 is less than ρ1.