CLEANING SOLUTION FOR A SUBSTRATE CONTAINING COPPER

• Main Authors: LEE, SANG DAI, JEONG, HYUN CHEOL, KIM, MIN HEE
• Format: Patent
• Language: English; Korean
• Published: 27.05.2016
• Subjects: ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES; BASIC ELECTRIC ELEMENTS; CANDLES; CHEMISTRY; DETERGENT COMPOSITIONS; DETERGENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FATTY ACIDS THEREFROM; METALLURGY; RECOVERY OF GLYCEROL; RESIN SOAPS; SEMICONDUCTOR DEVICES; SOAP OR SOAP-MAKING; USE OF SINGLE SUBSTANCES AS DETERGENTS

The present invention relates to a cleaning solution which comprises a compound having a triple bond in the molecular structure as a surfactant. The cleaning solution can effectively prevent etching of copper caused by an alkaline solution by being capable of selectively being adsorbed to copper and is not adsorbed to highly hydrophilic copper oxide, thereby maintaining etching capability. Thus, a cleaning solution having excellent effect of preventing corrosion of copper and capability to remove copper oxide. The cleaning solution of the present invention comprises a compound represented by chemical formula 1 or chemical formula 2. 본 발명에 따른 세정액은 분자 구조 내 삼중결합이 있는 화합물을 계면활성제로서 포함하는 것으로서, 구리표면에 선택적 흡착이 가능하여 알칼리 용액에 의한 구리의 식각은 효과적으로 막을 수 있고, 반면에 친수성이 높은 구리산화물에는 흡착하지 않아 식각력이 유지되므로 구리의 부식방지효과 및 구리산화물 제거력이 높은 세정액을 제공할 수 있다.