GROUND BLOCK FOR WIRE BONDING APPARATUS

A ground block for a wire bonding apparatus includes: a conductive block body placed on a guide rail; a contact member including a contact pin extended from the block body toward a substrate, and coming in contact with a ground area of the substrate; and an attaching member attaching the block body...

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Bibliographic Details
Main Authors SONG, KYU BONG, KIM, SUNG BOK, OH, DONG SUK, KIM, SEONG HWAN
Format Patent
LanguageEnglish
Korean
Published 26.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A ground block for a wire bonding apparatus includes: a conductive block body placed on a guide rail; a contact member including a contact pin extended from the block body toward a substrate, and coming in contact with a ground area of the substrate; and an attaching member attaching the block body to the guide rail to be detachable therefrom. Therefore, the present invention is capable of checking a defect of wire bonding even if the substrate is fixed to a heater block only with vacuum pressure. 와이어 본딩 장치용 접지 블록은 안내 레일 상에 놓이는 도전성 소재의 블록 본체; 블록 본체로부터 기판을 향해 연장하며 기판의 접지 영역과 접촉되는 접촉핀을 구비한 접촉 부재; 및 블록 본체를 안내 레일에 분리 가능하게 부착시키는 탈착 부재를 포함한다.
Bibliography:Application Number: KR20140160803