SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE COMPRISING THE SAME

According to an embodiment of the present invention, a semiconductor device comprises: a substrate; a first semiconductor package arranged on the substrate; and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package compris...

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Bibliographic Details
Main Authors BAE, JIN KWON, KIM, JAE CHOON, PARK, KYOL, JO, CHA JEA, KIM, JI CHUL
Format Patent
LanguageEnglish
Korean
Published 20.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to an embodiment of the present invention, a semiconductor device comprises: a substrate; a first semiconductor package arranged on the substrate; and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package comprises: a semiconductor chip stacked on the substrate; an adhesion part covering the semiconductor chip; and a heat-blocking structure arranged between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure. 본 발명의 실시예에 따른 반도체 장치는 기판, 상기 기판 상에 배치된 제 1 반도체 패키지, 상기 기판 상에 상기 제 1 반도체 패키지와 이격되어 배치된 제 2 반도체 패키지를 포함하되, 상기 제 2 반도체 패키지는, 상기 기판 상에 적층된 반도체 칩, 상기 반도체 칩을 덮는 접착부, 및 상기 기판과 상기 반도체 칩 사이에 배치된 열 차폐 구조를 포함하되, 상기 제 1 반도체 패키지에서 발생되어 상기 기판을 통해 상기 제 2 반도체 패키지로 전달되는 열은 상기 열 차폐 구조에 의해 차폐될 수 있다.
Bibliography:Application Number: KR20140156182