RESIN COMPOSITION

• Main Authors: TATSUMI SHIRO, EDO YUKINORI, NAKAMURA SHIGEO
• Format: Patent
• Language: English; Korean
• Published: 02.05.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention provides a resin composition which has excellent bending-inhibiting properties and smear-removing properties and allows production of a cured product capable of forming a conductive layer having high peel strength to the surface. The resin composition comprises: (A) an epoxy resin, and (B) a curing agent, wherein (A) the epoxy resin comprises (A1) an epoxy resin having a biphenyl backbone and diglycidyloxybenzene backbone, or (A2) an epoxy resin represented by chemical formula 1, and (B) the curing agent comprises at least one selected from the group comprising a phenol-based curing agent, a cyanate ester-based curing agent and an active ester-based curing agent. [과제] 휘어짐 억제성 및 스미어 제거성이 우수한 동시에, 표면으로의 높은 필 강도의 도체층의 형성이 가능한 경화물이 수득되는 수지 조성물을 제공하는 것. [해결 수단] (A) 에폭시 수지 및 (B) 경화제를 함유하는 수지 조성물로서, (A) 에폭시 수지가 (A1) 비페닐 골격 및 디글리시딜옥시벤젠 골격을 갖는 에폭시 수지를 포함하거나, 또는, (A2) 화학식 1로 표시되는 에폭시 수지를 포함하고, (B) 경화제가 페놀계 경화제, 시아네이트에스테르계 경화제 및 활성 에스테르계 경화제로부터 선택되는 1종 이상을 포함하는, 수지 조성물. [화학식 1]