SEMICONDUCTOR PACKAGE

According to a technical concept of the present invention, a semiconductor package comprises: a semiconductor chip having an active surface and a non-active surface; a ground member existing on the active surface of the semiconductor chip; and an electromagnetic shielding member passing through the...

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Bibliographic Details
Main Authors JUNG, YOUNG DOO, KIM, WOON BAE, SEO, BYOUNG RIM
Format Patent
LanguageEnglish
Korean
Published 29.04.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to a technical concept of the present invention, a semiconductor package comprises: a semiconductor chip having an active surface and a non-active surface; a ground member existing on the active surface of the semiconductor chip; and an electromagnetic shielding member passing through the semiconductor chip to be electrically connected to the ground member, and covering at least a portion of the non-active surface of the semiconductor chip. Therefore, the semiconductor package has an electromagnetic shielding structure with superior electromagnetic inference characteristics. 본 발명의 기술적 사상에 의한 반도체 패키지는, 활성면 및 비활성면을 갖는 반도체 칩, 반도체 칩의 활성면에 존재하는 접지 부재 및 반도체 칩을 관통하여 접지 부재와 전기적으로 연결되며 반도체 칩의 비활성면의 적어도 일부를 덮는 전자파 차폐 부재를 포함하는 것을 특징으로 한다.
Bibliography:Application Number: KR20140141692