RESIN FILM AND METHOD OF PRODCING RESIN FILM

• Main Authors: CHO, SEONG HEUN, KOBORI SHIGETO
• Format: Patent
• Language: English; Korean
• Published: 14.04.2016
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

Provided is a novel and advanced resin film which can improve antifouling and slippery properties as well as film strength. Also provided is a method for producing the resin film. According to the present invention, the resin film comprises: a low refraction index layer containing a plurality of hollow silica particles and a binder resin binding the hollow silica particles together; a photopolymerizable fluorine polymer and thermopolymerizable fluorine polymer both binding to the hollow silica particles distributed on a surface of the low fraction indect layer and repels against the binder resin, wherein the content of the hollow silica particles is 30-60 wt% inclusive, and the sum of the content of the photopolymerizable fluorine polyer and the thermopolymerizable fluorine polymer is 1-7 wt% inclusive. In addition, the content of the thermopolymerizable fluorine polymer is less than 2 wt%, and the ratio of the content between the thermopolymerizable fluorine polymer and the photopolymerizable fluorine polymer is 0.1-0.7 inclusive. 방오성 및 미끄러짐성을 향상시키고, 또한, 막 강도를 향상시키는 것이 가능한, 신규하면서도 개량된 수지막 및 수지막의 제조방법을 제공하는 것을 과제로 한다. 상기 과제를 해결하기 위하여, 본 발명의 하나의 관점에 따르면, 복수의 중공 실리카 입자와, 중공 실리카 입자끼리를 결합시키는 결착제 수지를 함유하는 저굴절률층과, 저굴절률층의 표면에 분포된 중공 실리카 입자에 결합하고, 또한 결착제 수지와 반발하는 광중합성 불소 폴리머 및 열중합성 불소 폴리머를 구비하되, 중공 실리카 입자의 함유율은 30질량% 이상 60질량% 이하이고, 광중합성 불소 폴리머 및 열중합성 불소 폴리머의 함유율의 합계는 1질량%보다 크고 7질량% 이하이며, 열중합성 불소 폴리머의 함유율은 2질량% 이하이고, 열중합성 불소 폴리머의 함유율과 광중합성 불소 폴리머의 함유율과의 비는 0.1 이상 0.7 이하인 것을 특징으로 하는 수지막이 제공된다.