CHOI, K. C., LEE, D. G., JUNG, K. D., CHO, T. J., & KIM, J. H. (2016). INITIATOR AND METHOD FOR DEBONDING OF WAFER SUPPORTING SYSTEM.
Chicago Style (17th ed.) CitationCHOI, KWANG CHUL, DONG GIL LEE, KYU DONG JUNG, TAE JE CHO, and JUNG HWAN KIM. INITIATOR AND METHOD FOR DEBONDING OF WAFER SUPPORTING SYSTEM. 2016.
MLA (9th ed.) CitationCHOI, KWANG CHUL, et al. INITIATOR AND METHOD FOR DEBONDING OF WAFER SUPPORTING SYSTEM. 2016.
Warning: These citations may not always be 100% accurate.