INITIATOR AND METHOD FOR DEBONDING OF WAFER SUPPORTING SYSTEM

• Main Authors: CHOI, KWANG CHUL, LEE, DONG GIL, JUNG, KYU DONG, CHO, TAE JE, KIM, JUNG HWAN
• Format: Patent
• Language: English; Korean
• Published: 06.04.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

Provided are a debonding initiator and a debonding method for a wafer supporting system (WSS). The wafer supporting system debonding initiator includes: a rotation chuck on which the wafer supporting system having a carrier wafer, a device wafer, and a glue layer is seated on a top surface to rotate, wherein the glue layer is configured to bond the carrier wafer and the device wafer; a detecting module for detecting a height and a thickness of the glue layer; and a laser module forming a fracture unit in the glue layer by emitting laser to a lateral surface of the glue layer based on the height and the thickness of the glue layer. The purpose of the present invention is to provide the debonding initiator of the wafer supporting system reducing with high debonding efficiency. 웨이퍼 서포팅 시스템 디본딩 이니시에이터 및 웨이퍼 서포팅 시스템 디본딩 방법이 제공된다. 상기 웨이퍼 서포팅 시스템 디본딩 이니시에이터는 캐리어 웨이퍼(carrier wafer)와, 디바이스 웨이퍼(device wafer)와, 상기 캐리어 웨이퍼와 상기 디바이스 웨이퍼를 본딩(bonding)하는 글루 레이어(glue layer)를 포함하는 웨이퍼 서포팅 시스템(wafer supporting system, WSS)을 상면에 안착시켜 회전시키는 로테이션 척(rotation chuck), 상기 글루 레이어의 높이 및 두께를 검출하는 디텍팅 모듈 및 상기 글루 레이어의 높이 및 두께를 바탕으로 상기 글루 레이어의 측면에 레이저를 조사하여 상기 글루 레이어에 파단부를 생성하는 레이저 모듈을 포함한다.