ADHESIVE BARRIER FILM CONSTRUCTION

• Main Authors: MCCORMICK FRED B, PIEPER JOSEPH M, NELSON ERIC W, NEBRASKA ADAM M, ECKERT KARISSA L
• Format: Patent
• Language: English; Korean
• Published: 29.03.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES; WORKING-UP

본 발명은 결합 층과 인접 배리어 층 사이에 고 박리 저항성을 갖는 결합부를 형성하는 것에 관한 것이다. 그러한 물품은 장치, 특히 발광 장치의 제조에 특히 유용하고, 발광 장치의 조립을 위한 방법이 기술된다. 발광 장치는 가요성 투명 배리어 필름 및 자외 (UV) 방사선 경화성 (메트)아크릴레이트 매트릭스를 사용하는 봉지 시스템을 포함한다. 감습성 발광 재료는, 예를 들어 필름, 또는 OLED 구조를 포함하는 필름 구조물 내에 배치된 양자점 재료일 수 있다. The present disclosure relates to forming a bond with a high peel resistance between a bonding layer and an adjacent barrier layer. Such articles are particularly useful in the preparation of a device, in particular a luminescent device, and a method is described for assembly of the luminescent device. The luminescent device includes an encapsulation system using flexible transparent barrier film and an ultraviolet (UV) radiation curable (meth)acrylate matrix. The moisture sensitive luminescent material can be, for example, a quantum dot material disposed in a film, or a film construction that includes an OLED structure.