COMPONENT PARTS PRODUCED BY THERMOPLASTIC PROCESSING OF POLYMER/BORON NITRIDE COMPOUNDS, POLYMER/BORON NITRIDE COMPOUNDS FOR PRODUCING SUCH COMPONENT PARTS AND USE THEREOF

• Main Authors: ZIMMERMANN JOHANNA, KAYSER ARMIN, UIBEL KRISHNA
• Format: Patent
• Language: English; Korean
• Published: 02.03.2016
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

본 발명은, 적어도 하나의 부분에서 3 mm 이하의 벽 두께를 갖는, 열가소성 가공에 의해 제조되는 구성 부품으로서, 구성 부품은 열가소성 가공가능한 중합체 재료 및 열전도성 충전제를 포함하고, 충전제는 질화붕소 응집체를 포함하는, 구성 부품에 관한 것이다. 본 발명은 게다가 그러한 구성 부품을 제조하기 위한 중합체/질화붕소 배합물에 관한 것이다. 본 발명은 게다가 냉각될 구성 부품 또는 조립체로부터의 방열을 위한 그러한 구성 부품의 용도에 관한 것이다. The invention relates to a component part produced by thermoplastic processing, having a wall thickness of at most 3 mm on at least one part of the component part, wherein the component part comprises a thermoplastically processable polymer material and a thermally conductive filler, wherein the filler comprises boron nitride agglomerates. The invention furthermore relates to a polymer/boron nitride compound for producing such a component part. The invention furthermore relates to the use of such a component part for heat dissipation from component parts or assemblies to be cooled.