MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE

• Main Authors: TODA JUNKO, TSUKAMOTO TAKEHITO, MANIWA SUSUMU
• Format: Patent
• Language: English; Korean
• Published: 24.02.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

제1면과 제2면을 갖는 금속판과, 상기 제1면에 형성된 접속용 포스트와, 상기 제2면에 형성된 배선과, 프리 몰드용 수지층을 구비한 리드 프레임 기판으로서, 상기 프리 몰드용 수지의 두께가, 상기 접속용 포스트의 높이와 동일한 것을 특징으로 하는 리드 프레임 기판이 제공된다. A manufacturing method of a lead frame substrate includes: applying a photosensitive resist or a dry film to first and second surfaces of a metal plate; pattern-exposing the photosensitive resist or the dry film, and then developing the first surface and the second surface to form on the first surface a first resist pattern for forming a connection post and to form on the second surface a second resist pattern for forming a wiring pattern; etching the first surface partway down the metal plate to form the connection post; filling the first surface with a pre-molding resin to a thickness with which the etched surface is buried; removing the pre-molding resin uniformly in a thickness direction of the pre-molding resin until a bottom surface of the connection post is exposed; and etching the second surface to form a wiring pattern.