PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

• Main Authors: KANG, MYUNG SAM, LEE, SEUNG EUN, KOOK, SEUNG YEOP, LEE, YOUNG KWAN
• Format: Patent
• Language: English; Korean
• Published: 24.02.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention relates to a printed circuit board and a method of manufacturing the same. The printed circuit board according to the embodiment of the present invention includes an insulating layer with a via hole, a via which is formed in the via hole, a first circuit pattern which is formed in the lower part of the insulating layer and is electrically connected to the via, and a second circuit pattern which is formed in the upper part of the insulating layer and is bonded to the via. The diameter of the via is smaller than that of the via hole. 본 발명은 인쇄회로기판 및 인쇄회로기판의 제조 방법에 관한 것이다. 본 발명의 실시 예에 따른 인쇄회로기판은 비아홀이 형성된 절연층, 비아홀 내부에 형성된 비아, 절연층의 하부에 형성되어 비아와 전기적으로 연결되는 제1 회로 패턴 및 절연층의 상부에 형성되어 비아와 접합되는 제2 회로 패턴을 포함하며, 비아는 비아홀보다 작은 직경을 갖도록 형성된다.