PACKAGE BOARD AND PACKAGE USING THE SAME

• Main Authors: KANG, MYUNG SAM, LEE, SEUNG EUN, KOOK, SEUNG YEOP, IM, SE RANG
• Format: Patent
• Language: English; Korean
• Published: 23.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The present invention relates to a package board and a package using the same. According to an embodiment of the present invention, the package board comprises: an insulating layer; a dielectric layer formed on an upper part of the insulating layer; a lower electrode formed on the whole surface of an upper surface of the insulating layer; and an upper electrode formed on the whole surface of an upper surface of the dielectric layer. 본 발명은 패키지 기판 및 이를 이용한 패키지에 관한 것이다. 본 발명의 실시 예에 따르면 패키지 기판은 절연층, 절연층의 상부에 형성된 유전체층, 절연층 상면의 전면에 형성된 하부 전극 및 유전체층의 상면의 전면에 형성된 상부 전극을 포함한다.