CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

A method for manufacturing a circuit board comprises: forming a seed layer and a resist layer on a solder resist layer; then forming a connection pad and a pad plated layer by patterning the resist layer; removing the resists layer after that; and removing the seed layer exposed to the outside. The...

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Bibliographic Details
Main Authors KANG, MYUNG SAM, LEE, SEUNG EUN, KWON, KWANG HEE, KOOK, SEUNG YEOP, IM, SE RANG
Format Patent
LanguageEnglish
Korean
Published 22.12.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A method for manufacturing a circuit board comprises: forming a seed layer and a resist layer on a solder resist layer; then forming a connection pad and a pad plated layer by patterning the resist layer; removing the resists layer after that; and removing the seed layer exposed to the outside. The circuit board can load a device. A connection terminal of the device and the connection pad of the circuit board can be connected by a wire or the like. 솔더레지스트층 상에 씨드층 및 레지스트층을 형성한 뒤, 레지스트층을 패터닝하여 접속패드 및 패드 도금층을 형성하며, 그 이후에, 레지스트층을 제거하고, 외부로 노출된 씨드층을 제거한다. 이 회로기판에는 디바이스가 탑재될 수 있으며, 디바이스의 접속단자와 회로기판의 접속패드가 와이어 등에 의하여 연결될 수 있다.
Bibliography:Application Number: KR20140070914