INERTIAL SENSOR MODULE HAVING A HERMETIC SEAL OF FORMING METAL AND MULTI-AXIS SENSOR EMPLOYING THE SAME

• Main Authors: LEE, JUNG WON, KANG, PIL JOONG, LEE, HYUN KEE, SONG, JONG HYEONG
• Format: Patent
• Language: English; Korean
• Published: 18.12.2015
• Subjects: GYROSCOPIC INSTRUMENTS; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT; MEASURING; MEASURING DISTANCES, LEVELS OR BEARINGS; MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; NAVIGATION; PERFORMING OPERATIONS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY; PHYSICS; SURVEYING; TESTING; TRANSPORTING

According to the present invention, an inertial sensor module having a metallic hermetic seal and a multi-axis sensor using the same comprise: a sensor body which comprises a plurality of wires connected to either a driving electrode of a sensor or a detecting electrode of the sensor and is formed in a wafer level package (WLP) method on a substrate for a lower cap to detect inertial force; a substrate for an upper cap, which is boned onto the sensor body to protect the sensor body; and a metallic hermetic seal which is isolated from the wires and interposed between the sensor body and the substrate for an upper cap wherein the bonding is metal bonding. 본 발명의 금속의 허메틱 실을 갖는 관성센서모듈 및 그를 사용한 다축센서는 센서의 구동전극 및 센서의 감지전극 중 어느 하나와 연결되는 복수의 배선을 구비하며, 웨이퍼 레벨 패키지(WLP: Wafer Level Package) 방식으로 하부캡용 기판에 형성되어 관성력을 검출하는 센서본체와, 상기 센서본체 상에 접합 되어 상기 센서본체를 보호하는 상부캡용 기판 및 상기 배선과 격리되며, 상기 접합이 메탈본딩(Metal Bonding)으로 접합 되어 상기 센서본체와 상기 상부캡용 기판에 개재되는 금속의 허메틱 실을 을 포함한다.