HOT-MELT ADHESIVE

• Main Authors: MAEDA NAOHIRO, MORIGUCHI MASAHIRO, INOUE KENTAROU
• Format: Patent
• Language: English; Korean
• Published: 02.12.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

본 발명은 저온에서 적용가능하고 저온에서 탁월한 접착성을 갖는 핫-멜트 접착제, 및 핫-멜트 접착제를 사용해 수득한 일회용품을 제공한다는 과제를 다룬다. 상기 핫-멜트 접착제는 비닐방향족 탄화수소를 사용해 수득되고, 35-45 wt% 의 스티렌 함량 및 50-90 wt% 의 디블록 함량, 및 25℃ 에서의 점도가 250 mPa·s 이하인 25 wt% 톨루엔 용액을 갖는 라디칼 스티렌 블록 공중합체 (A1) 을 포함하는 열가소성 블록 공중합체 (A) 를 포함한다. Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25°C as a 25% (by weight) toluene solution of not more than 250 mPa ·s (A1).