SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT

According to an embodiment of the present invention, a heat management system for an electronic device includes a heat frame, a conformal slot portion, a chassis frame and a heat fin. The heat frame, the conformal slot, the chassis frame and the heat fin are formed integrally as a unitary structure...

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Bibliographic Details
Main Authors WETZEL TODD GARRETT, RUSH BRIAN MAGANN, LASSINI STEFANO ANGELO MARIO, GERSTLER WILLIAM DWIGHT
Format Patent
LanguageEnglish
Korean
Published 16.10.2015
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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