TIN-SILVER ELECTROPLATING SOLUTION, PRODUCING METHOD THEREOF AND FORMATION METHOD OF TIN-SILVER SOLDER BUMP USING THE SAME

• Main Authors: JUNG, OH GON, PARK, BYOUNG JOON, HUR, WOOK HWAN, KIM, JAE HWAN, WOO, KYOUNG HAN, PARK, DONG KWAN, OH, SANG BONG
• Format: Patent
• Language: English; Korean
• Published: 13.10.2015
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The present invention relates to a tin-silver electroplating solution, to a manufacturing method thereof, and to a method of forming a tin-silver solder bump using the same. More specifically, the present invention relates to a tin-silver electroplating solution which is not harmful to the environment by not containing lead and compounds of cyanidation, to the manufacturing method thereof, and to the method of forming tin-silver solder bump using the same. To achieve this purpose, the tin-silver electroplating solution in accordance to the present invention comprises a silver ion complexing agent including: divalent tin ions, monovalent silver ions, a sulfur-containing compound, and a thioamide compound wherein a total content of the silver ion complexing agent is 5-100 g/L and a weight ratio of the sulfur-containing compound to the thioamide compound is 2-5:1. 본 발명은 주석-은 전기 도금액, 그 제조방법 및 그를 이용하여 주석-은 솔더 범프를 형성하는 방법에 관한 것으로서, 보다 상세하게는 납 및 시안화(cyanidation)화합물을 함유하지 않아 환경에 유해하지 않은 주석-은 전기 도금액, 그 제조방법 및 그를 이용하여 주석-은 솔더 범프를 형성하는 방법에 관한 것이다. 이를 위해 본 발명에 따른 주석-은 전기 도금액은 2가 주석이온, 1가 은이온, 함황화합물 및 티오아마이드 화합물을 포함하면서 총 함량이 5~100g/L이고, 함황화합물 : 티오아마이드 화합물의 중량비가 2~5 : 1인 은이온 착화제를 포함하는 것을 특징으로 한다.