ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC COMPONENTS

An electronic assembly disclosed includes: a first electronic component that includes a first substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the first substrate; and a second electronic component that includes a second substrate having...

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Bibliographic Details
Main Authors MEYER THORSTEN, ALBERS SVEN, BARTH HANS JOACHIM, MAHNKOPF REINHARD
Format Patent
LanguageEnglish
Korean
Published 07.10.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic assembly disclosed includes: a first electronic component that includes a first substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the first substrate; and a second electronic component that includes a second substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the second substrate. The back side of the first substrate is directly attached to the back side of the second substrate. 전자 어셈블리는 전면 및 후면을 갖는 제 1 기판과 제 1 기판의 전면 상에 장착되는 적어도 하나의 전자 디바이스를 포함하는 제 1 전자 컴포넌트와, 전면 및 후면을 갖는 제 2 기판과 제 2 기판의 전면 상에 장착되는 적어도 하나의 전자 디바이스를 포함하는 제 2 전자 컴포넌트를 포함하고, 제 1 기판의 후면은 제 2 기판의 후면에 직접 부착된다.
Bibliography:Application Number: KR20150025214