TWO-STEP DEPOSITION WITH IMPROVED SELECTIVITY

• Main Authors: KOLICS ARTUR, NALLA PRAVEEN, VARADARAJAN SESHASAYEE
• Format: Patent
• Language: English; Korean
• Published: 05.10.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method for providing an electroless plating over at least one copper containing layer is provided. Surfaces of the at least one copper containing layer are sealed by selectively depositing a sealing layer of catalytically active metal on the at least one copper containing layer. The sealing layer...