TWO-STEP DEPOSITION WITH IMPROVED SELECTIVITY
A method for providing an electroless plating over at least one copper containing layer is provided. Surfaces of the at least one copper containing layer are sealed by selectively depositing a sealing layer of catalytically active metal on the at least one copper containing layer. The sealing layer...
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Main Authors | , , |
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Format | Patent |
Language | English Korean |
Published |
05.10.2015
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Subjects | |
Online Access | Get full text |
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